HomepageBlogBT Resin From Mitsubishi Gas Chemical Helps Make Semiconductor Packaging Lighter, Thinner and Smaller Blog MaterialsBT Resin From Mitsubishi Gas Chemical Helps Make Semiconductor Packaging Lighter, Thinner and Smaller admin Posted on August 14, 2023 Mitsubishi Gas Chemical Co. Inc. (MGC; TYO:4182) is working to open up new applications for its semiconductor packaging substrate materials…….Please subscribe to read the full story.Author admin View all posts Post navigationPrevious PostSigns Point to Supply–Demand Ease for Polyolefins in Asia–Pacific Next PostPackaging Sector Enters Era of Major Reform – Part 7: The Pursuit of Carbon NeutralityYou Might Also Like BlogMucuna bennettii: Tanaman Adaptogen yang Meningkatkan Mood dan Mengurangi Stres Black Ling January 3, 2025 BlogMETI Seeks to Scale up Demonstration Testing in Plastic Recycling Project admin August 14, 2023 BlogChemical Industry Leader Outlooks for 2022 – Part 3: Petrochemical Complexes Show Transformation admin August 14, 2023 BlogMitsubishi Chemical Holdings Pledges to Reach Carbon Neutrality by 2050 admin August 14, 2023
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