HomepageBlogBT Resin From Mitsubishi Gas Chemical Helps Make Semiconductor Packaging Lighter, Thinner and Smaller Blog MaterialsBT Resin From Mitsubishi Gas Chemical Helps Make Semiconductor Packaging Lighter, Thinner and Smaller admin Posted on August 14, 2023 Mitsubishi Gas Chemical Co. Inc. (MGC; TYO:4182) is working to open up new applications for its semiconductor packaging substrate materials…….Please subscribe to read the full story.Author admin View all posts Post navigationPrevious PostSigns Point to Supply–Demand Ease for Polyolefins in Asia–Pacific Next PostPackaging Sector Enters Era of Major Reform – Part 7: The Pursuit of Carbon NeutralityYou Might Also Like BlogToray Looks to Ramp up PPS Production admin August 14, 2023 BlogChemical Industry Leader Outlooks for 2021 – Part 2: Predicting the Year’s Economic Environment admin August 14, 2023 BlogPackaging Sector Enters Era of Major Reform – Part 3: Western Chemical Firms Refine Their Technologies admin August 14, 2023 BlogJapanese Semiconductor Materials Companies Look to Procurement Alternatives as Japan – South Korea Saga Drags On admin August 14, 2023
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