HomepageBlogBT Resin From Mitsubishi Gas Chemical Helps Make Semiconductor Packaging Lighter, Thinner and Smaller Blog MaterialsBT Resin From Mitsubishi Gas Chemical Helps Make Semiconductor Packaging Lighter, Thinner and Smaller admin Posted on August 14, 2023 Mitsubishi Gas Chemical Co. Inc. (MGC; TYO:4182) is working to open up new applications for its semiconductor packaging substrate materials…….Please subscribe to read the full story.Author admin View all posts Post navigationPrevious PostSigns Point to Supply–Demand Ease for Polyolefins in Asia–Pacific Next PostPackaging Sector Enters Era of Major Reform – Part 7: The Pursuit of Carbon NeutralityYou Might Also Like BlogKuraray Moves to Offer Range of New Materials for Sports & Outdoor Wear admin August 14, 2023 BlogMCHG Positions Carbon Fiber SMCs for Use in Automotive Structural Materials admin August 14, 2023 BlogFujitsu Laboratories Looks to Apply Chemical Knowledge Graph in Materials Informatics admin August 14, 2023 BlogCompetition Ramps up Between Metals and Plastics in Market for EV Battery Case Materials admin August 14, 2023
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